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LED Grid Release Paper
LED Grid Release Paper
Scope of Application
This series of products are mainly used in LED chip packaging field.
Features
The modified resin was coated and extruded with wood pulp paper
The blue membrane has good adsorption
Good flatness, no warpage
High surface cleanliness
Product Parameter

Color: light yellow and white
Grid: rhombic grid, pattern plane
Thickness: 120 ~ 220um
Weight: 100 ~ 180g / m2
Release: silicon free release layer

Application Scenarios
This series of products are mainly used in LED chip packaging field
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Contact
399 Jindong Road, Jinxi Town, Kunshan City, Jiangsu
+86-512-57227007
+86-512-57230098
info@matsumoto-co.com
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